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Mechanical properties and thermal conductivity of epoxy composites enhanced  by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging  application | SN Applied Sciences
Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application | SN Applied Sciences

Polymers | Free Full-Text | Physical, Thermal Transport, and Compressive  Properties of Epoxy Composite Filled with Graphitic- and Ceramic-Based  Thermally Conductive Nanofillers
Polymers | Free Full-Text | Physical, Thermal Transport, and Compressive Properties of Epoxy Composite Filled with Graphitic- and Ceramic-Based Thermally Conductive Nanofillers

Improving the thermal conductivity of epoxy composites using a  combustion-synthesized aggregated β-Si3N4 filler with randomly oriented  grains | Scientific Reports
Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains | Scientific Reports

Molecules | Free Full-Text | Thermal Conductivity of Epoxy Resin Composites  Filled with Combustion Synthesized h-BN Particles
Molecules | Free Full-Text | Thermal Conductivity of Epoxy Resin Composites Filled with Combustion Synthesized h-BN Particles

Mechanical reinforcement with enhanced electrical and heat conduction of epoxy  resin by polyaniline and graphene nanoplatelets
Mechanical reinforcement with enhanced electrical and heat conduction of epoxy resin by polyaniline and graphene nanoplatelets

Enhanced thermal conductivity of epoxy composites filled with  tetrapod-shaped ZnO - RSC Advances (RSC Publishing) DOI:10.1039/C8RA01470A
Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO - RSC Advances (RSC Publishing) DOI:10.1039/C8RA01470A

Application: Epoxy – Thermal conductivity
Application: Epoxy – Thermal conductivity

Table 1 from A review of thermal conductivity of epoxy composites filled  with Al2O3 or SiO2 | Semantic Scholar
Table 1 from A review of thermal conductivity of epoxy composites filled with Al2O3 or SiO2 | Semantic Scholar

Thermal Diffusivity and Thermal Conductivity of Epoxy-Based Nanocomposites  by the Laser Flash and Differential Scanning Calorimetry Techniques
Thermal Diffusivity and Thermal Conductivity of Epoxy-Based Nanocomposites by the Laser Flash and Differential Scanning Calorimetry Techniques

PDF] Thermal conductivity of the epoxy resin filled by low melting point  alloy | Semantic Scholar
PDF] Thermal conductivity of the epoxy resin filled by low melting point alloy | Semantic Scholar

SciELO - Brasil - Analysis of effective thermal conductivity for mineral  cast material structures with varying epoxy content using TPS method  Analysis of effective thermal conductivity for mineral cast material  structures with
SciELO - Brasil - Analysis of effective thermal conductivity for mineral cast material structures with varying epoxy content using TPS method Analysis of effective thermal conductivity for mineral cast material structures with

Thermal conductivity of unmodified epoxy and nanocomposites a at... |  Download Scientific Diagram
Thermal conductivity of unmodified epoxy and nanocomposites a at... | Download Scientific Diagram

High Thermal Conductivity of Bulk Epoxy Resin by Bottom-Up Parallel-Linking  and Strain: A Molecular Dynamics Study | The Journal of Physical Chemistry C
High Thermal Conductivity of Bulk Epoxy Resin by Bottom-Up Parallel-Linking and Strain: A Molecular Dynamics Study | The Journal of Physical Chemistry C

Journal of Applied Polymer Science | Wiley Online Library
Journal of Applied Polymer Science | Wiley Online Library

Improved thermal conductivity of epoxy resin by graphene–nickel  three-dimensional filler - ScienceDirect
Improved thermal conductivity of epoxy resin by graphene–nickel three-dimensional filler - ScienceDirect

Molecules | Free Full-Text | Thermal Conductivity of Epoxy Resin Composites  Filled with Combustion Synthesized h-BN Particles
Molecules | Free Full-Text | Thermal Conductivity of Epoxy Resin Composites Filled with Combustion Synthesized h-BN Particles

Thermally Conductive Epoxy Adhesives | MasterBond.com
Thermally Conductive Epoxy Adhesives | MasterBond.com

Journal of Applied Polymer Science | Wiley Online Library
Journal of Applied Polymer Science | Wiley Online Library

Thermal conductivity of epoxy and its composites. | Download Table
Thermal conductivity of epoxy and its composites. | Download Table

Improving the thermal conductivity of epoxy composites using a  combustion-synthesized aggregated β-Si3N4 filler with randomly oriented  grains | Scientific Reports
Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains | Scientific Reports

A 3D interconnected Cu network supported by carbon felt skeleton for highly  thermally conductive epoxy composites - American Chemical Society
A 3D interconnected Cu network supported by carbon felt skeleton for highly thermally conductive epoxy composites - American Chemical Society

Thermal conductivity measured for a number of epoxy resin based... |  Download Table
Thermal conductivity measured for a number of epoxy resin based... | Download Table

Enhanced thermal conductivity of epoxy/alumina composite through  multiscale-disperse packing - Hongkun Li, Weidong Zheng, 2021
Enhanced thermal conductivity of epoxy/alumina composite through multiscale-disperse packing - Hongkun Li, Weidong Zheng, 2021

Duralco® Thermally Conductive epoxy
Duralco® Thermally Conductive epoxy

Molecules | Free Full-Text | Thermal Conductivity of Epoxy Resin Composites  Filled with Combustion Synthesized h-BN Particles
Molecules | Free Full-Text | Thermal Conductivity of Epoxy Resin Composites Filled with Combustion Synthesized h-BN Particles

Mechanical properties and thermal conductivity of epoxy composites enhanced  by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging  application | SN Applied Sciences
Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application | SN Applied Sciences